Thermaltake TG-30 Premium CPU/GPU Heatsink Thermal Compound | 4G | CL-O023-Grosgm-A

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Description

[Performance Compound] Contains Diamond Powder for HEAT Transfer Providing a Thermal Conductivity of 4.5 W/M-Kit. [All-in-One Application Kit] Includes Tools to Clean, PREP, and Install Forestermal. y ] Special Formulated to Easily Spread Over the Included Honeycomb Stendicil for Consistent Compound Application, Providing a NEAT and Well-COVED CPU. Of Short Circuit and Offers A Longe Lifespan Minimizing Dry-Out or Cracking

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